Rigid PCB Capacity

Items

Mass production

Sample

Standard

IPC Class II & III or specified by customer

IPC Class II & III or specified by customer

Material

FR1, CEM-1, FR-4,Aluminum, high frequency (ROGERS, TEFLON, TACONIC)

FR1, CEM-1, FR-4,Aluminum, high frequency (ROGERS, TEFLON, TACONIC)

Layers number

1-32 layers

1-40 layers

Max. Panel Size

24"*32" ( 609mm*813mm )

24.5” × 47”  ( 622mm ×1200mm )

Max. Board Thickness

6mm

8mm

Min. Board Thickness

0.4mm

0.2mm

Min. line width/spacing

0.1/0.1mm(4/4mil)

0.076/0.076mm(3/3mil)

Min. Hole Size

0.2mm(7.87mil)

0.15mm(6mil)

PTH Dia. Tolerance

±0.076mm(±3mil)

±0.05mm(±2mil)

NPTH Dia. Tolerance

±0.05mm(±2mil)

±0.025mm(±1mil)

Hole Position Deviation

±0.076mm(±3mil)

±0.05mm(±2mil)

Max. Aspect ratio

10:1

12:1

Heavy copper

4 OZ (140um)

6 OZ (210um)

Hole wall copper thickness of PTH

18-50um

18-50um

Surface Finished

OSP,HASL,HASL(lead free),Gold Finger, ENIG, Immersion Silver, Immersion Tin

OSP,HASL,HASL(lead free),Gold Finger, ENIG, Immersion Silver, Immersion Tin

Max. solder mask or resin plug hole diameter

0.6mm

0.8mm

Min. solder mask dam

3mil

3mil

Solder Mask color(LPI)

Green, Black, Blue, White, Yellow, Red

Green, Black, Blue, White, Yellow, Red

Silkscreen color

White , Black

White ,Black

Outline

Routing, V-CUT, Beveling, Punching

Routing, V-CUT, Beveling ,Punching

Outline Tolerance

±0.13mm(±5mil)

±0.1mm(±4mil)

Peelable Mask

Top, bottom, double Sided

Top, bottom, double Sided

Impedance Control

±10%

±8%

Warp and Twist

≤0.75%

≤0.5%

Flammability

94V-0

94V-0