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The difference between the plating gold and the immersion gold(ENIG)-Shenzhen Vip Circuit Co.,Ltd

Base difference between the plating gold and the immersion gold(ENIG):

Plating gold: use the principle of electrolysis,golden white, solderability is not very good, occasionally poor solderability situation,and the skin effect is unfavorable to the transmission of high frequency signals.Gold surface easy to be oxidation and the combining ability of solder mask is not strong.

Immersion gold: use a chemical deposition method,golden yellow,with good solderability,the skin effect has no effect on the signals.Gold surface not easy to be oxidation,the combining ability of solder mask is strong.

In the actual trial process, 90% of the plating gold can be replace by the immersion gold technology,plating gold with poor solderability is its shortcomings,so this is the direct cause of many companies abandoning plating gold.Gold is widely used in contact lines because of its small electrical conductivity, such as keypad PCB, gold finger PCB etc., the most fundamental difference between the plating gold and immersion gold is that plating gold is hard gold,but immersion gold is soft gold.

What is the immersion gold: through the chemical redox reaction method to form a layer of gold coating, which is a chemical nickel gold layer deposition method, the general gold thickness of the immersion gold is around 0.0254um---0.127um,Ni is 2.54um---6um.The general gold thickness of the plating gold is ≥ 0.5um,thickness of Ni is the same as ENIG which is 2.54um---6um too.

From the cost point of view, because of the thickness of gold and the process are not the same between the plating gold and immersion gold, the cost of plating gold will be much higher than immersion gold.So it is recommended to use the immersion gold technology priority if there is no special requirements.


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