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Printed Circuit Board Terminology in PCB processing-Vip Circuit

Printed Circuit Board Terminology in PCB process-1

PCB Sort (PCB分类)

Single sided board(单面板)

Double sided Board(双面板)

Multilayer Board(多层板) AA

Rigid board(刚性板)

Flexible board(挠性板)

Flex-rigid board(刚挠结合板)

Metal base PCB(金属基板)

Blind board(盲孔板)

Buried board(埋孔板)

Bare board (裸板)

Quick turn prototype(样板)

 

PCB Material(PCB材料)

Copper clad laminate(CCL)(覆铜板)

PREPREG(半固化片)

Epoxy resin(环氧树脂)

Copper foil(铜箔)

PTFE (Polytetralluoetylene)

Teflon(聚四氟乙烯)

Dielectric constant(介电常数)

Flexible copper clad(挠性覆铜板)

Silver film(银盐片)

Diazo film(重氮片)

Solder mask(阻焊)

Dry film(干膜)

Legend ink(字符油墨)

Peelable solder mask(可剥离阻焊)

Flux(助焊剂)

Additive(添加剂)

 

PCB Process(PCB 生产流程

Wet process(湿法流程)     Dry process(干法流程)

FOR MULTILAYER MANUFACTURE PROCESS(多层线路板生产流程)

Laminate cut(覆铜板→scrubbing(擦板)  →Image transfer(图形转移→ internal layer(内层) Exposure(曝光→ Developing(显影)→ ETCHING(蚀刻→ black / brown oxygen(黑/棕化)→ lay up(叠层→Laminating(层压→ Drilling(钻孔→ scrubbing(擦板→ Plated through hole(孔金属化) PTH → panel plating(板面电镀→ pattern plating (plated resist) (图形电镀→ Etching(蚀刻)→Inspection(检验)→ Printing solder mask(阻焊印刷)→ Exposure(曝光→ Developing(显影)→ Hot Cured(热固化)→ Hot Air Leveling(热风整平)→ IMMERSION GOLD(沉金)→ Printing legend ink (silkscreen printing)(字符印刷)Hot Cured(热固化)→ Routing(铣外形)→punch(冲孔)→ Bare board testing(裸板测试)→ Final Inspection(终检)→ Packing(包装)→ Delivery(发货)

 

Water treatment(水处理)

DI (dialysis ion) water(去离子水)

Waste water treatment(污水处理)

Humidity (湿度)

Temperature(温度)

 

PCB InspectionPCB 检验)

Inspection standard(检验标准)

Defect open(开路)

Short(短路)

Measling(白斑)

Fibre exposure(漏基材)

Hole breakout(破孔)

Flatness(平面度)

Peel strength(剥离强度)

Thermal shock(热冲击)

Thermal stress(热应力)

Reworking(返工)

Manufacture panel(制造拼板)

Light integrator(光积分仪)

Step scale(光尺)

Undercut factor(侧蚀系数)

Micro etching(微蚀)

Over etching(过蚀)

Swimming(滑移)

 

Major Equipments(主要设备)

Laser plotter(激光光绘机)

CNC drilling machine(数控钻床)

CNC routing machine(数控铣床)

Scrubber(擦板机)

Auto through hole plating line(自动沉铜线)

panel plating line(板面电镀线)

pattern plating line (plated resist) (图形电镀线)

dry film laminator(贴膜机)

Exposure(曝光机)

developing line(显影线)

Etching line(蚀刻线)

Auto registration punch(冲孔机)

Multilayer press system(多层板层压系统)

Black oxidation line(黑化线)

Automatic optical instrument AOI(自动光学检测仪)

Flying Probe test FPT(飞针检测仪)

Hot air leveling(热风整平机)

Impedance control test system(阻抗控制检测仪)

 

Engineering Design(工程设计)

lay out(布线)  CAD(computer aided design) (计算机辅助设计)  CAM(computer aided manufacture) (计算机辅助制造)  EDA(Electronic design automatic) (电子设计自动化) origin(原点) mirroring(镜相) scaling factor(比例系数) network(网络) conductor track(导线) PAD(焊盘)  width(宽度) gap spacing(间隙)  aperture(光圈)  round(圆形) oblong(长圆形)  square(正方形) rectangle(长方形)  tearpad(泪滴焊盘) isolation pad(隔离焊盘) thermal pad(热焊盘)

mounting hole(安装孔)   via(过孔)  Plating through hole PTH(金属化孔)  NPTH(非金属化孔) tooling hole(定位孔)  Fiducial  (基准点、反光点)  layer to layer spacing(层间距)   layer Building up drawing(层叠图)    external layer(外层) internal layer(内层) power layer(电源层) ground layer(接地层)  signal line(信号线)  target(标靶)   slot(槽孔)    tabconnector (golden finger) (金手指)  Impedance control PCB(阻抗控制)   Golden board(黄金板)    MI (manufactureinformation) (制造说明)  NOPE( no process engineering ) (重订单)  photo plottinglaser plotting)(激光光绘)  positive(正片)  negative(负片)

 

Component Assembly(元器件组装)

SMT (Surface mount technology) (表面贴装技术)

Bonding(邦定) DIP(dual inline package) (双列直插封装) QFP(quad flat package) (四面扁平封装) BGA(ballgrid array ) (球栅封装)

SMD (Surface mount devices) (表面贴装设备)  Placement machine(贴装机)

REFOLW SOLDERING(回流焊)   WAVE SOLDERING(波峰焊)



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